University of Wah (UW) and University of Engineering and Technology (UET), Lahore, have formally signed a Memorandum of Understanding (MoU) aimed at enhancing academic cooperation, research excellence, and institutional collaboration between the two prestigious universities.
The MoU signing ceremony was held on 12 May 2026 at the University of Wah. The agreement was formally signed by Prof. Dr. Jameel-Un Nabi, Vice Chancellor-UW, and Prof. Dr. Shahid Munir, VC-UET, in the presence of senior officials and representatives from both institutions.
This strategic partnership marks an important milestone in fostering collaborative initiatives in higher education and research. Under the agreement, both universities will work together in several key areas, including joint research projects and publications, academic exchange programs, graduate supervision, resource sharing, funding opportunities, and industrial linkages.
The MoU also emphasizes the importance of innovation, knowledge exchange, and institutional cooperation to address emerging academic and technological challenges. Intellectual property generated through collaborative efforts will be managed in accordance with the respective institutional policies and the guidelines of the Higher Education Commission (HEC) of Pakistan.
Furthermore, the agreement promotes a model of shared responsibility, enabling both institutions to utilize their existing expertise and resources to achieve mutually beneficial objectives without imposing immediate financial obligations.
Speaking on the occasion, the leadership of both universities expressed confidence that the partnership would contribute significantly to strengthening research capacity, promoting academic excellence, and creating new opportunities for students, faculty members, and researchers. By leveraging their combined strengths and expertise, the University of Wah and UET Lahore aim to cultivate an environment of innovation and academic growth that will positively impact the national education and research landscape.
